Figured out WHY lockups, now to figure how to fix!

[Wayne]

There's a rocker switch on the right rear of the GD-ROM unit, that the lid depresses.

I don't think the DC will hold a liquid. It's not a sealed unit (gaps in the shield, holes in the bottom of the case, etc).

The problem with using a thermal grease or other compound exclusively is that there is a gap between the shield and the two LSI chips. There is a need for a thermally conductive spacer between the two, although I don't know how thick this spacer must be yet because I haven't measured the depth of the shield or the height of the chips. With those two measurements, one could use simple subtraction to derrive a required thickness for the added heat-sink plates.

I would really like to keep the solution self-contained so I don't have to carry added items for the game. Making thermal connection between the shield and the tops of the LSI chips would have a good potential to cure the overheats and allow a self-contained solution.